Xenon Plasma FIB Focussed Ion Beam with Ultra-High Resolution SEM UHR SEM/i-FIB

The XEIA3 is TESCAN’s flagship instrument combining the world’s sharpest Xenon plasma FIB (Focussed Ion Beam) column with an Ultra-High Resolution (UHR) SEM column. The marriage of these systems enables you to perform the most challenging milling and materials removal operations at speeds not previously possible with the highest levels of precision. This turn key solution opens up new possibilities in terms of research and applications.

The UHR SEM/i-FIB combination is well suited to high-throughput microanalytical applications. High milling rates matched with rapid data acquisition allows speedy analysis of large volumes of sample in short time frames. This, analyses such as 3D EDX and 3D EBSD becomes a simple operation and precise TOF-SIMS analysis becomes a a routine operation.

Xenon Plasma FIB

Most conventional FIBs use Liquid Metal Ion Source (LMIS) such as a gallium (Ga) ion source. Ga FIB’s deliver a small spot size, with performance dropping off at high currents (>10nA) and spot size increases making them unsuitable for large volume milling. The Xe plasma ion source FIB overcomes this limitation with much higher beam currents possible, resulting in far greater rates of materials removal. Furthermore, the Xe plasma FIB has a superior lifetime and current stability.

Example: Using a Xe plasma FIB can perform a milling polishing task in 30 minutes compared to 40 hrs for a Ga FIB. Furthermore, the Xe plasma FIB ion flux is more consistent with excellent spatial uniformity which is suited to automated, precision milling.

Ultra-High Resolution SEM

The XEIA is now equipped with Triglav® technology providing you with sub-nanometer resolution and increased stability. The XEIA excels when it comes to imaging at low accelerating voltages. This makes it especially suited to imaging sensitive materials such as integrated circuits, biological specimens and other life science studies.

Key Features

• Powerful ultra-high resolution SEM column equipped with a high brightness Schottky emitter for high currents, low-noise and extraordinary imaging
• In-Beam detectors for excellent imaging at low energies and very short working distances
• Ultra-fast xenon plasma ion source FIB – high beam currents for outstanding milling speeds and an excellent performance in sputtering large volumes of material, and low beam currents for smooth polishing.
• Less implantation, doping or degradation of insulator deposition, a valuable feature for semiconductor industry
• Simultaneous SEM imaging during FIB milling or deposition (the whole process can be observed directly)
• Unique and advanced TESCAN’s technologies in terms of automated operations such as the In-Flight Beam TracingTM designed to accurately compute and adjust all the optimal parameters for high resolution imaging
• Advanced patterning and 3D characterisations capabilities powered by DrawBeam, a pattern editing tool that also provides real-time visualisation during milling or lithographic processes
• High-performance electronics for faster image acquisition up to 20 ns/pxl, an excellent deposition rate and ultra-fast scanning
• Novel solution for fast 3D microanalysis such as 3D EDX and EBSD reconstructions
• 12’’, 8” and 6” wafer inspection by means of an extended chamber – an exclusive TESCAN feature
• Unique integration with TOF-SIMS
• Gas Injection System (GIS) for enhancing your FIB applications
• Powerful turbomolecular and dry fore vacuum pump for keeping the chamber clean. Electron gun pumping by ion getter pump in ultra-high vacuum

Triglav Technology

TriLens™ objective system. (a) IML, (b) Analytical lens, (c) UH-resolution lens

TESCAN have upped the ante with the release of their next generation Triglav Ultra-High Resolution (UHR) SEM column. Thanks to the TriLens and EquiPower technologies,  users can achieve sub-nanometer resolution down to 0.7nm at 15keV and an impressive 1nm at 1keV making it ideal for imaging nano-sized features.

Triglav provides you with improved imaging and analytical capabilities while also providing enhanced surface sensitivity and image contrast at the extremely low beam energies. Triglav columns are now standard on TESCAN’s range of UHR SEMs including the

• XEIA (Xe Plasma FIB-SEM)
• GAIA (Ga FIB-SEM)
• MAIA (FEG-SEM)

The higher performance and improved imaging of these systems can be attributed to unique electron optics and a robust detection system. The new column includes the TriLens^TM (three objective lenses) and TriSE/TriBSE (3 SE and 3 BSE detectors) mated together resulting in different imaging modes to suit your specific requirements.

The Triglav column incorporates three SE and angle-selective BSE detectors providing maximum surface and compositional contrast. Additionally, the chamber has been redesigned to cater for larger samples.

EquiPower technology introduces new levels of beam stability. While this technology will benefit imaging operations, it really comes to the fore with time consuming operations such as FIB milling and automated TEM lamellae preparation.

Brochure

Click here to download the XEIA Ultra-High Resolution SEM/Xe Plasma FIB brochure.